[총 검색 데이터 : 9582 건] 제품이미지를 클릭하시면 상세정보를 보실 수 있습니다. Part No.

 Item CHIP BEAD-3216
 Description 3216. 600 OHM 400mA. used for EMI suppression filter
 Vendor SAMSUNG
 D/C 00+
 Part No. CIM31J601NE
 Q'ty 78 EA
 Item CHIP BEAD-3216
 Description Size:3216. 600 ohm 400mA. used for EMI suppression filter
 Vendor SAMSUNG
 D/C 00+
 Part No. CIM31J601NE
 Q'ty 6000 EA
 Item CHIP BEAD-2012
 Description Size:2012(0805). 600 ohm 200mA. Chip Ferrite Bead. On-Board Type (DC) EMI Suppression Filters (EMIFILr)
 Vendor MURATA
 D/C 00+
 Part No. BLM21B601SPTM00-03
 Q'ty 11200 EA
 Item CHIP RESISTOR-3225
 Description Size:3225(1210). 62 OHM-5%. 0.25W(1/4W). SMD/Chip Resistor. 칩저항
 Vendor SAMSUNG
 D/C n/a
 Part No. RC3225J620CS. 62ohm-J. 0.25W
 Q'ty 75000 EA
 Item CHIP RESISTOR-3225
 Description Size:3225(1210). 150J-0.25W. 15 OHM-5%-0.25W(1/4W)
 Vendor SAMSUNG
 D/C 07+
 Part No. RC3225J150CS. 15 ohm-J 0.25W (1/4W)
 Q'ty 50000 EA
 Item CHIP RESISTOR-1608
 Description Size:1608(0603). 549 ohm-1%. Chip Resistor. 칩저항
 Vendor YAGEO
 D/C n/a++
 Part No. RC0603FR-07-549R. 549ohm-F
 Q'ty 50000 EA
 Item MLCC-3216-broken
 Description Size:3216(1206). 153K 50V. 15nF 50V. 1500PF 50V. 0.015UF 50V-10%. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL31B153KBNC. 15nF50V. 15000pF50V. 0.015uF50V. 153K50V
 Q'ty 3800 EA
 Item MLCC-2012
 Description Size:2012 (0805). 2.2nF 50V-5%. 2200pF 50V-5%. 222J 50V. 0.0022uF 50V-5%. C0G. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 03+
 Part No. CL21C222JBNE. 2.2nF50V-J. 2200pF50V. 222J50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 391J 50V. 390pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C n/a+
 Part No. CL21C391JBNC. 391J50V. 390pF50V-J. 2012CH390PF
 Q'ty 11600 EA
 Item MLCC-3216-broken
 Description Size:3216(1206). 2.2nF 50V-10%. 2200pF 50V 222K 50V. X7R MLCC. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C n/a
 Part No. CL31B222KBNC. 2.2nF50V. 2200pF50V. 222K50V
 Q'ty 3500 EA
 Item MLCC-1608
 Description Size:1608(0603). 681K 50V. 680pF 50V-10%. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL10B681KBNC. 680pF50V. 681K50V
 Q'ty 4000 EA
 Item MLCC-3216
 Description Size:3216(1206). 821J 50V. 820pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL31C821JBNC. 820pF50V. 820J50V
 Q'ty 32000 EA
 Item BEAD CORE EMI FILTER
 Description Size:3.5x8.0mm. 50V 3A. Dual Radial Type. EMC Components. Ferrite Bead Filters
 Vendor TDK
 D/C 03+
 Part No. ZBF503M-00TA-K
 Q'ty 2550 EA
 Item CHIP RESISTOR ARRAY
 Description Size:3216(1206). (4p. 1608x4 Resistors). 51 OHM-5%. Chip Network Resistor. Chip Array Resistor. 칩 어레이 저항
 Vendor SAMSUNG
 D/C n/a++
 Part No. RN164PJ510CS. 51ohm-J
 Q'ty 75000 EA
 Item CHIP RESISTOR ARRAY
 Description Size:3216(1206). (4p. 1608x4 Resistors). 51 OHM-5%. Chip Network Resistor. Chip Array Resistor. 칩 어레이 저항
 Vendor SAMSUNG
 D/C n/a
 Part No. RN164PJ510CS. 51ohm-J
 Q'ty 115000 EA
 Item MLCC-1608
 Description Size:1608(0603). 100D 50V. 10PF 50V-±0.5PF. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C100DBNC. 10pF50V-D. 100D50V
 Q'ty 40000 EA
 Item MLCC-3216
 Description Size:3216. 102K 50V. 1nF 50V-10%. 1000PF 50V-10%. X7R
 Vendor SAMSUNG
 D/C 02+
 Part No. CL31B102KBNC
 Q'ty 4000 EA
 Item CHIP RESISTOR-3216
 Description Size:32161206)..2.1K OHM-1%. Chip Resistor
 Vendor YAGEO
 D/C n/a+
 Part No. RC1206FR-07-2K1. 2.1Kohm-F
 Q'ty 30000 EA
 Item CHIP RESISTOR-1608
 Description Size:1608(0603). 121K OHM-1%. Chip Resistor
 Vendor YAGEO
 D/C n/a+
 Part No. RC0603FR-07-121K. 121K ohm-F
 Q'ty 120000 EA
 Item CHIP RESISTOR-1608
 Description Size:1608(0604) 340K OHM-1%. Chip Resistor
 Vendor YAGEO
 D/C 02+
 Part No. RC0603FR-07-340K, 340Kohm-F
 Q'ty 30000 EA

   

 
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