[총 검색 데이터 : 9585 건] 제품이미지를 클릭하시면 상세정보를 보실 수 있습니다. Part No.

 Item MLCC-2012-broken
 Description Size:2012(0805). 473K 50V. X7R 47nF 50V-10%. 47000pF 50V. 0.047uF 50V. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21B473KBNCR. 47nF50V. 47000pF50V. 0.047uF50V. 473K50V. X7R
 Q'ty 2190 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 473K 50V. X7R 47nF 50V-10%. 47000pF 50V. 0.047uF 50V. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21B473KBNC. 47nF50V. 47000pF50V. 0.047uF50V. 473K50V. X7R
 Q'ty 3700 EA
 Item MLCC-2012
 Description Size:2012. X7R. 472K50V. 4.7nF 50V-10%. 0.0047UF 50V-10%. 4700PF 50V-10%. Multilayer Ceramic Capacitors
 Vendor SAMSUNG
 D/C 95+
 Part No. CL21B472KBNCA
 Q'ty 14500 EA
 Item IC-NNN
 Description SSOP-8
 Vendor ANY
 D/C n/a
 Part No. 4W66
 Q'ty 1570 EA
 Item MLCC-2012
 Description Size:2012. X7R. 472K50V. 4.7nF 50V-10%. 0.0047UF 50V-10%. 4700PF 50V-10%. Multilayer Ceramic Capacitors
 Vendor SAMSUNG
 D/C 01+
 Part No. CL21B472KBNC
 Q'ty 28000 EA
 Item MLCC-2012
 Description Size:2012. X7R. 472K50V. 4.7nF 50V-10%. 0.0047UF 50V-10%. 4700PF 50V-10%. Multilayer Ceramic Capacitors
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21B472KBNC
 Q'ty 4000 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 471K 50V. 470pF 50V-10%. X7R. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21B471KBNCA. 471K50V. 470pF50V
 Q'ty 3550 EA
 Item MLCC-2012
 Description Size:2012(0805). 471K 50V. 470pF 50V-10%. X7R. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 03+
 Part No. CL21B471KBNC. 471K50V. 470pF50V
 Q'ty 12000 EA
 Item MLCC-2012
 Description Size:2012(0805). 471K 50V. 470pF 50V-10%. X7R. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21B471KBNC. 471K50V. 470pF50V
 Q'ty 8000 EA
 Item MLCC-2012
 Description Size:2012(0805). 471K 50V. 470pF 50V-10%. X7R. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 03+
 Part No. CL21B471KBNC. 471K50V. 470pF50V
 Q'ty 84000 EA
 Item MLCC-2012
 Description Size:2012(0805). X7R. 39nF 50V-10%. 39000pF 50V-10%. 0.0039uF 50V-10%. 393K 50V. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서.
 Vendor SAMSUNG
 D/C n/a
 Part No. CL21B393KBNCR. 39nF50V-K. 39000pF50V-K. 0.0039uF50V-K. 393K50V
 Q'ty 3800 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 272K 50V. 2.7nF 50V-10%. 0.0027UF 50V-10%. 2700PF 50V-10%. X7R. Multilayer Ceramic Cihp Capacitors
 Vendor SAMSUNG
 D/C 01+
 Part No. CL21B272KBNCA. 2.7nF50V. 2700pF50V. 0.0027uF50V. 272K50V
 Q'ty 3560 EA
 Item MLCC-2012
 Description Size:2012(0805). 272K 50V. 2.7nF 50V-10%. 0.0027UF 50V-10%. 2700PF 50V-10%. X7R. Multilayer Ceramic Cihp Capacitors
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21B272KBNC. 2.7nF50V. 2700pF50V. 0.0027uF50V. 272K50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 474Z 16V. 470nF 16V. 0.47uF 16V. 470000pF 16V. MLCC. Multilayer Ceramic Capacitor. 칩세라믹콘덴서
 Vendor PHILIPS
 D/C 04+
 Part No. 2238-780-19858. 08052F474Z7B20D. 470nF16V. 0.47uF16V. 470000pF16V. 474Z16V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 105Z 25V. 1UF 25V-+80~-20%. 1.0UF 25V-+80%~-20%. CHIP CERAMIC CAPACITOR
 Vendor TDK
 D/C 00+
 Part No. C2012JF1E105ZT000N. 1.0uF25V. 1uF25V
 Q'ty 1050 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 222K 50V. 2.2nF 50V-10%. 2200PF 50V-10%. 0.0022UF 50V-10%. X7R. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21B222KBNC. 2.2nF50V. 2200pF50V. 0.0022uF50V. 222K50V. 2012B2.2nF
 Q'ty 3120 EA
 Item CONNECTOR
 Description 4pin-2.5mm
 Vendor GEOYOUNG
 D/C 04+
 Part No. LSW250-04
 Q'ty 102 EA
 Item MLCC-2012
 Description Size:2012(0805). 222K 50V. 2.2nF 50V-10%. 2200PF 50V-10%. 0.0022UF 50V-10%. X7R. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 05+
 Part No. CL21B222KBNC. 2.2nF50V. 2200pF50V. 0.0022uF50V. 222K50V. 2012B2.2nF
 Q'ty 84000 EA
 Item MLCC-2012
 Description Size:2012(0805). 222K 50V. 2.2nF 50V-10%. 2200PF 50V-10%. 0.0022UF 50V-10%. X7R. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 07+
 Part No. CL21B222KBNC. 2.2nF50V. 2200pF50V. 0.0022uF50V. 222K50V. 2012B2.2nF
 Q'ty 64000 EA
 Item 권선볼륨. Winding volume
 Description Size:55x43mm. Wire Wound Potentiometer.
 Vendor ANY
 D/C n/a
 Part No. 50W250J. 50W250ohm.(250ΩJ) 권선볼륨
 Q'ty 10 EA

   

 
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