[총 검색 데이터 : 9585 건] 제품이미지를 클릭하시면 상세정보를 보실 수 있습니다. Part No.

 Item MLCC-2012
 Description Size:2012(0805). 471K 100V. 470PF 100V-10%. MLCC. Multilayer Ceramic Chip Capacitor. 칩 세라믹 콘덴서. 칩 세라믹 커패시터
 Vendor AVX
 D/C n/a
 Part No. 08051A471KAT050R. 470pF100V. 471K100V
 Q'ty 2000 EA
 Item MLCC-2012
 Description Size:2012 (0805). 271J 100V. 270pF 100V-5%. MLCC. Multilayer Ceramic Chip Capacitor. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor AVX
 D/C n/a
 Part No. 08051A271JAT050R. 270pF100V. 271J100V
 Q'ty 36000 EA
 Item MLCC-2012-broken
 Description Size:2012 (0805). 271J 100V. 270pF 100V-5%. MLCC. Multilayer Ceramic Chip Capacitor. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor AVX
 D/C n/a
 Part No. 08051A271JAT050R. 270PF100V. 271J100V
 Q'ty 3800 EA
 Item MLCC-2012
 Description 2012. 681J 50V. 680PF 50V-5%. CHIP CERAMIC CAPACITOR
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C681JBNC
 Q'ty 16000 EA
 Item MLCC-2012
 Description Size:2012(0805). 680J 50V. 68PF 50V-5%. CHIP CERAMIC CAPACITOR
 Vendor SAMSUNG
 D/C 03+
 Part No. CL21C680JBNC. 68pF50V-J
 Q'ty 12000 EA
 Item MLCC-2012
 Description Size:2012(0805). 680J 50V. 68PF 50V-5%. CHIP CERAMIC CAPACITOR
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C680JBNC. 68pF50V-J
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 680J 50V. 68PF 50V-5%. CHIP CERAMIC CAPACITOR
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C680JBNC. 68pF50V-J
 Q'ty 8000 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 561J 50V. 560pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C561JBNCA. 560PF50V. 561J50V
 Q'ty 3960 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 561J 50V. 560pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 01+
 Part No. CL21C561JBNC. 560PF50V. 561J50V
 Q'ty 2680 EA
 Item MLCC-2012
 Description Size:2012(0805). 561J 50V. 560pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 03+
 Part No. CL21C561JBNC. 560PF50V. 561J50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description 2012. 560K 50V. 56PF 50V-10%. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C560KBNC
 Q'ty 100000 EA
 Item MLCC-2012
 Description 2012. 560K 50V. 56PF 50V-10%. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C560KBNC
 Q'ty 24000 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 56pF 100V-5%. 560J 100V. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C560JCNCA. 56pF100V. 560J100V
 Q'ty 1910 EA
 Item MLCC-2012
 Description 2012. 510J 50V. 51PF 50V-5%
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C510JBNC
 Q'ty 4000 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 4.7pF 50V. 4R7C 50V. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL21C4R7CBNCS. 4.7pF50V. 4R7C50V
 Q'ty 4300 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 4.7pF 100V. 4R7C 100V. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C4R7CCNC. 4.7pF100V. 4R7C100V
 Q'ty 3800 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 470pF 50V. 471 J50. VMLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C471JBNC. 470pF50V. 471J50V.
 Q'ty 3150 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 47pF 100V-5%. 470J 100V. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C470JCNCA. 47pF100V. 470J100V
 Q'ty 2976 EA
 Item MLCC-2012-broken
 Description Size:2012(0805. 3.3pF 50V-±0.25pf. ). 3R3C 50V. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C3R3CBNC. 3.3pF50V. 3R3C50V
 Q'ty 3600 EA
 Item MLCC-2012
 Description Size:2012(0805). 391J 50V. 390pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C n/a++
 Part No. CL21C391JBNCA. 390pF50V-J. 391J50V. 2012CH390PF
 Q'ty 4000 EA

   

 
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