[총 검색 데이터 : 9702 건] 제품이미지를 클릭하시면 상세정보를 보실 수 있습니다. Part No.

 Item MLCC-2012
 Description Size:2012 (0805). 300J 50V. 30pF 50V-5%. MLCC. Multilayer Ceramic SMD/Chip Capacitor. 칩 세라믹 콘덴서. 칩 세라믹 커패시터
 Vendor SAMSUNG
 D/C 05++
 Part No. CL21C300JBNC. 30pF50V-J. 300J50V
 Q'ty 64000 EA
 Item MLCC-2012
 Description Size:2012 (0805). 300J 50V. 30pF 50V-5%. MLCC. Multilayer Ceramic SMD/Chip Capacitor. 칩 세라믹 콘덴서. 칩 세라믹 커패시터
 Vendor SAMSUNG
 D/C 05+
 Part No. CL21C300JBNC. 30pF50V-J. 300J50V
 Q'ty 64000 EA
 Item MLCC-2012
 Description Size:2012. 240J 50V. 24PF 50V-5%. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C240JBNC
 Q'ty 16000 EA
 Item ALUMINUM CAPACITOR
 Description Size:16x45mm. 2200uF 50V. 85C
 Vendor SAMHWA
 D/C n/a
 Part No. 2200UF50V. 85℃. 16x45mm
 Q'ty 50 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 271J 50V. 270PF 50V-5%. COG. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C271JBNC. 270pF50V-J. 271J50V
 Q'ty 1743 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 151J 50V. 150pF 50V-5%. Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 01+
 Part No. CL21C151JBNCA. 150pF50V. 151J50V
 Q'ty 2160 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 151J 50V. 150pF 50V-5%. Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL21C151JBNCA. 150pF50V. 151J50V
 Q'ty 3500 EA
 Item MLCC-2012
 Description 2012. 122J 50V. 1.2nF 50V-5%. 1200PF 50V-5%. 0.12UF 50V-5%. CHIP CERAMIC CAPACITOR
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C122JBNE
 Q'ty 2000 EA
 Item MLCC-2012
 Description Size:2012(0805). 121J 50V. 120pF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C121JBNC. 120pF50V-J. 121J50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 121J 50V. 120pF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C121JBNC. 120pF50V-J. 121J50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 121J 50V. 120pF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C121JBNC. 120pF50V-J. 121J50V
 Q'ty 24000 EA
 Item MLCC-2012
 Description Size:2012(0805). 120J 50V. 12pF 50V-5%. Chip Ceramic Capacitor
 Vendor SAMSUNG
 D/C 98+
 Part No. CL21C120JBNCA. 12pF50V. 120J50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 120J 50V. 12pF 50V-5%. Chip Ceramic Capacitor
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C120JBNC. 12pF50V. 120J50V
 Q'ty 3000 EA
 Item MLCC-2012
 Description Size:2012(0805) 100J 50V, 10pF 50V-5%, MLCC, SMD/Chip Ceramic Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C100JB8NNNC, CL21C100JBNC, 100J50V, 10pF50V-J
 Q'ty 164000 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 101J 100V. 100pF 100V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21C101JCNCA. 100pF100V. 101J100V
 Q'ty 3550 EA
 Item MLCC-2012-broken
 Description Size:2012(0805).101J 50V. 100pF 50V-5%. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C101JBNCA. 100pF50V. 101J50V
 Q'ty 1300 EA
 Item MLCC-2012-broken
 Description Size:2012(0805) 100J 50V, 10pF 50V-5%, MLCC, SMD/Chip Ceramic Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C100JBNC, 100J50V, 10pF50V-J, CL21C100JB8NNNC
 Q'ty 3600 EA
 Item MLCC-2012
 Description Size:2012(0805). 2.2nF 50V. 2200pF 50V. 0.0022uF 50V. 222J 50V. Chip Monolithic Ceramic Capacitor. MONO. 모노콘덴서. 모노리틱콘덴서
 Vendor MURATA
 D/C 02+
 Part No. GRM40CH222J50 S500. 2.2nF50V. 2200pF50V. 222J50V
 Q'ty 3000 EA
 Item MLCC-2012
 Description Size:2012(0805). 181K 50V. 180pF 50V-10%. X7R. Chip Ceramic Capacitor
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21B181KBNC. 180pF50V. 181K50V. 2012B180pF
 Q'ty 0 EA
 Item MLCC-2012
 Description Size:2012(0805). 560J 50V. 56pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL21C560JBNC. 56pF50V. 560J50V
 Q'ty 1500 EA

   

 
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