[총 검색 데이터 : 9585 건] 제품이미지를 클릭하시면 상세정보를 보실 수 있습니다. Part No.

 Item MLCC-1608-broken
 Description Size:1608(0603). 3.3pF 50V-±0.25pF. 3R3C 50V. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C3R3CBNCA. 3.3pF50V. 3R3C50V
 Q'ty 3650 EA
 Item MLCC-1608
 Description Sise:1608(0603). 330J 50V. 33PF 50V-5%. MLCC. SMD/CHIP CERAMIC CAPCITOR. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 03+
 Part No. CL10C330JBNC. 33pF50V-J. 330J50V
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608. 220J 50V. 22PF 50V-5%. Multilayer Ceramic Chip Capacitors
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C220JBNC
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608. 200J 50V. 20pF 50V-5%
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C200JBNC
 Q'ty 12000 EA
 Item MLCC-1608
 Description 1608. 1R8C 50V. 1.8PF 50V-±0.25pf. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C1R8CBNC
 Q'ty 20000 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 150J 50V. 15pF 50V 5%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C150JBNC. 15pF50V. 150J50V
 Q'ty 3900 EA
 Item MLCC-1608
 Description Size:1608(0603). 101J 50V. 100PF 50V-5%. MLCC. SMD/Chip Ceramic Cihp Capacitor. 칩세라믹콘덴서.
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C101JBNC. 100pF50V-J. 101J50V
 Q'ty 0 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 562K50V. 5.6nF50V-K. 5600pF50V. 0.0056uF50V. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10B562KBNC. 562K50V. 5.6nF50V-K. 5600pF50V. 0.0056uF50V
 Q'ty 2400 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 563K 16V. 56nF 16V-10%. 0.056UF 16V-10%. 56000PF 16V-10%. X7R. Multilayer Ceramic Chip Capacitors. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10B563KONC. 56nF16V-K. 56000PF16V-K. 0.056UF16V-K. 563K16V
 Q'ty 2522 EA
 Item MLCC-1608
 Description Size:1608(0603). 100J 50V. 10PF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C100JBNC. 10pF50V-J. 100J50V
 Q'ty 8000 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 121J 50V. 120pF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL10C121JBNC. 120pF50V-J. 121J50V
 Q'ty 2386 EA
 Item MLCC-1608
 Description Size:1608(0603). 100J 50V. 10PF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 04+
 Part No. CL10C100JBNC. 10pF50V-J. 100J50V
 Q'ty 0 EA
 Item MLCC-1608
 Description Size:1608(0603). 100D 50V. 10PF 50V-±0.5PF. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 04+
 Part No. CL10C100DBNC. 10pF50V-D. 100D50V
 Q'ty 8000 EA
 Item MLCC-0603
 Description Size:0603(0201). 1.3pF25V-0.1%. SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
 Vendor MURATA
 D/C n/a
 Part No. GRM33CH1R3B25 M641. 1.3pF25V-B
 Q'ty 15000 EA
 Item MLCC-1608
 Description Size:1608(0603). 070C 50V. 7PF 50V-±.25pf. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C070DBNC. 7pF50V. 1608CH7pF
 Q'ty 4000 EA
 Item DIODE
 Description DO-201AD. 600V 3A. Ultrafast Plastic Rectifier Diode.
 Vendor GULF SEMI
 D/C n/a
 Part No. 31GF6. 31GF6-810
 Q'ty 0 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 682K 50V. 6.8nF 50V-10%. 0.0068UF 50V-10%. 6800PF 50V-10%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10B682KBNC. 6.8nF50V-K. 0.0068UF50V. 6800PF50V. 682K50V
 Q'ty 3980 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 682K 50V. 6.8nF 50V-10%. 0.0068UF 50V-10%. 6800PF 50V-10%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10B682KBNC. 6.8nF50V-K. 0.0068UF50V. 6800PF50V. 682K50V
 Q'ty 2000 EA
 Item MLCC-1608
 Description Size:1608(0603). 682K 50V. 6.8nF 50V-10%. 0.0068UF 50V-10%. 6800PF 50V-10%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10B682KBNC. 6.8nF50V-K. 0.0068UF50V. 6800PF50V. 682K50V
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608(0603). 681K 50V. 680pF 50V-10%. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10B681KBNCM. 680pF50V. 681K50V
 Q'ty 4000 EA

   

 
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