[총 검색 데이터 : 9759 건] 제품이미지를 클릭하시면 상세정보를 보실 수 있습니다. Part No.

 Item MLCC-1608-broken
 Description Size:1608(0603). 681K 50V. 680PF 50V-10%. Chip Ceramic Capacitor. 칩세라믹콘덴서.
 Vendor AVX KYOCERA
 D/C 00+
 Part No. CM105X7R681K50AT. 680pF50V. 681K50V
 Q'ty 3628 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 102J 50V. 1nF 50V-5%. 1000PF 50-5%. 0.001uF 50V. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor KYOCERA
 D/C 00+
 Part No. CM105CG102J50AT. 1nF50V. 1000pF50V. 0.001uF50V. 102J50V
 Q'ty 2557 EA
 Item 권선볼륨. Winding volume
 Description Size:85x54mm. Wire Wound Potentiometer
 Vendor ANY
 D/C n/a
 Part No. 100W 250J. 100W 250ohm-J (250ΩJ) 권선볼륨
 Q'ty 10 EA
 Item MLCC-1608
 Description 1608. 270J 50V. 27PF 50V-5%.
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10T270JBCC
 Q'ty 8000 EA
 Item MLCC-1608
 Description 1608. 224Z16V. 220nF 16V-±20~80%. 220000PF 16-±20~80%. 0.22UF 16V-±20~80%. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 03+
 Part No. CL10F224ZONC
 Q'ty 4000 EA
 Item MLCC-1608-broken
 Description Size:1608(0603) C0G(NP0) 6R8C 50V, 6.8pF 50V±0.25pF, MLCC, Multilayer Ceramic SMD/Chip Ceramic Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL10C6R8CBNC, 6.8pF50V-C, 6R8C50V
 Q'ty 3870 EA
 Item MLCC-1608
 Description 1608. 681J 50V. 680PF 50V-5%. Multilayer Ceramic Capacitor
 Vendor SAMSUNG
 D/C n/a
 Part No. CL10C681JBNC
 Q'ty 4000 EA
 Item MLCC-2012
 Description 2012. 680J 50V. 68pF 50V-5%
 Vendor TDK
 D/C 99+
 Part No. C2012COG1H680JT000A
 Q'ty 4000 EA
 Item MLCC-1608
 Description 1608. 561J 50V. 560PF 50V-5%. Multilayer Ceramic Capacitor
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C561JBNC
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608(0603) 471K 50V, 470pF 50V-10%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C471KBNC, 470pF50V, 471K50V
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608(0603) 3.3pF 50V-±0.25pF, 3R3C 50V, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C3R3CBNC A, 3.3pF50V, 3R3C50V
 Q'ty 3650 EA
 Item MLCC-1608
 Description Sise:1608(0603). 330J 50V. 33PF 50V-5%. MLCC. SMD/CHIP CERAMIC CAPCITOR. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 03+
 Part No. CL10C330JBNC. 33pF50V-J. 330J50V
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608. 220J 50V. 22PF 50V-5%. Multilayer Ceramic Chip Capacitors
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C220JBNC
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608. 200J 50V. 20pF 50V-5%
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C200JBNC
 Q'ty 12000 EA
 Item MLCC-1608
 Description 1608. 1R8C 50V. 1.8PF 50V-±0.25pf. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C1R8CBNC
 Q'ty 20000 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 150J 50V. 15pF 50V 5%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C150JBNC. 15pF50V. 150J50V
 Q'ty 3900 EA
 Item MLCC-1608
 Description Size:1608(0603). 101J 50V. 100PF 50V-5%. MLCC. SMD/Chip Ceramic Cihp Capacitor. 칩세라믹콘덴서.
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C101JBNC. 100pF50V-J. 101J50V
 Q'ty 0 EA
 Item MLCC-1608
 Description Size:1608(0603) C0G(NP0) 101J 50V, 100PF 50V-5%, MLCC, Multilayer Ceramic SMD/Cihp Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서.
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C101JBNC, 100pF50V-J, 101J50V
 Q'ty 1100 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 562K50V. 5.6nF50V-K. 5600pF50V. 0.0056uF50V. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10B562KBNC. 562K50V. 5.6nF50V-K. 5600pF50V. 0.0056uF50V
 Q'ty 2400 EA
 Item MLCC-1608
 Description Size:1608(0603) X7R, 563K 16V, 56nF 16V-10%, 0.056uF 16V-10%.,56000pF 16V-10%, MLCC, Multilayer Ceramic SMD/Chip Capacitors, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10B563KONC, 56nF16V, 56000pF16V, 0.056uF16V, 563K16V
 Q'ty 2522 EA

   

 
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