[Total : 9862] Click the product image. You can find more detail info. Part No.

 Item CHIP INDUCTOR-2012
 Description 2012. 12nH-5%. Melf Type. Fixed Inductor
 Vendor MATSUSHITA
 D/C n/a
 Part No. ELTNR12NJF2
 Q'ty 6000 EA
 Item CHIP INDUCTOR-2012
 Description Size:2012 (0805). 470nH-10%. 0.47uH-10%. SMD/Chip Inductor. 칩 인덕터
 Vendor SAMSUNG
 D/C n/a
 Part No. CIL21NR47KNEM. 470nH-K. 0.47uH-K
 Q'ty 1700 EA
 Item FUSE-GLASS BODY-6.3x31mm
 Description Size:6.75x32mm-250V1A (UL CSA) AXIAL
 Vendor SJ
 D/C n/a
 Part No. 250V 1A-62NM, 62NM-250V1A
 Q'ty 1400 EA
 Item CHIP INDUCTOR-2012
 Description Size:2012(0805) 330nH-20%, 0.33uH-20%, For Signal Line (Multilayer, Magnetic Shielded). SMD/Chip RF Inductor Coils. 라인신호용(다층, 자기차폐). RF 칩 인덕터 코일
 Vendor TDK
 D/C n/a
 Part No. MLF2012DR33MT000, 330nH-M. 0.33uH
 Q'ty 4000 EA
 Item CHIP INDUCTOR-1608
 Description Size:1608(0603) 15nH-5%, 0.015uH-5%, SMD/Chip inductor, 칩 인덕터
 Vendor TAYIO YUDEN
 D/C n/a
 Part No. HK1608-15NJ-T, 15nH-J, 0.015uH
 Q'ty 3700 EA
 Item CHIP INDUCTOR-1608
 Description 1608. 68nH-5%. For High Frequency(Multilayer) SMD Inductor(Coils)
 Vendor TDK
 D/C 99+
 Part No. MLG1608B68NJ-T000
 Q'ty 2500 EA
 Item CHIP INDUCTOR-1005
 Description Siz:1005(0402). 5.6nH-10%.(0.0056uH). FOR HIGH FREQUENCY MULTILAYER CHIP INDUCTOR
 Vendor TAIYO YUDEN
 D/C 02+
 Part No. HK1005-5N6K-T. 5.6nF-K. 0.0056uH
 Q'ty 30000 EA
 Item CHIP INDUCTOR-1608
 Description Size:1608(0603) 8.2nH-5%, 0.0082uH, For High Frequency Multilayer SMD/Chip Inductor, 칩 인덕터
 Vendor TAIYO YUDEN
 D/C n/a++
 Part No. HK1608-8N2J-T, 8.2nH-J, 0.0082uH
 Q'ty 16000 EA
 Item CHIP INDUCTOR-1608
 Description Size:1608(0603) 8.2nH-5%, 0.0082uH, For High Frequency Multilayer SMD/Chip Inductor, 칩 인덕터
 Vendor TAIYO YUDEN
 D/C 00+
 Part No. HK1608-8N2J-T, 8.2nH-J, 0.0082uH
 Q'ty 3000 EA
 Item CHIP INDUCTOR-1608
 Description Size:1608(0603) 8.2nH-5%, 0.0082uH, For High Frequency Multilayer SMD/Chip Inductor, 칩 인덕터
 Vendor TAIYO YUDEN
 D/C 01+
 Part No. HK1608-8N2J-T, 8.2nH-J, 0.0082uH
 Q'ty 160000 EA
 Item CHIP INDUCTOR-1608
 Description Size:1608(0603) 15nH-10% SMD Multilayer UHF Band Chip Inductor, High Q values For High Frequency Application, SMD 다층 UHF 대역 칩 인덕터, 높은 Q 값 고주파용으로 적합
 Vendor TDK
 D/C n/a
 Part No. MLR1608M15NKTC00, 15nH-K. 0.015uH-K
 Q'ty 16000 EA
 Item CHIP INDUCTOR-1608
 Description Size:1608(0603). 15nH-5%. 0.015uH-5%. SMD/Chip Inductor. 칩 인덕터
 Vendor FUJITSU TOWA
 D/C 03+
 Part No. CL-FHFI-15NJ-D2M0. 15nH-J. 0.015uH-J
 Q'ty 9700 EA
 Item CHIP INDUCTOR-1005
 Description Siz:1005(0402). 3.9nH-±0.3nH.(0.0039UH). FOR HIGH FREQUENCY MULTILAYER CHIP INDUCTOR
 Vendor TAIYO YUDEN
 D/C 00+.02+
 Part No. HK1005-3N9S-T. 3.9nH-S. 0.0039uH
 Q'ty 20000 EA
 Item SENSOR
 Description Size:1.55x0.9mm. SMD HALL SENSOR ELEMENT
 Vendor PIONEER
 D/C 99+
 Part No. LPH1002-B
 Q'ty 9000 EA
 Item FUSE-SMD/CHIP
 Description Size:3216(1206) 32V 2A, SMD Thin-Film Fuse, SMD Thin-Film Fuse, SMD 박막형 퓨즈/휴즈
 Vendor AVX
 D/C n/a
 Part No. F1206A2R00FWTR, 32V2A
 Q'ty 2900 EA
 Item FUSE-SMD/CHIP
 Description Size:2.69x6.1mm. 125V 800mA. Nano Surface Mount Very Fast Acting Fuse
 Vendor LF
 D/C n/a
 Part No. LF800mA Marking Code. 800mA Chip Fuse
 Q'ty 1400 EA
 Item FUSE-GLASS BODY-6.3x31mm
 Description Size:6.35x31mm. 125V 750mA. (UL.CSA)
 Vendor TRIAD
 D/C 98+
 Part No. 61NM-125V-750mA
 Q'ty 200 EA
 Item FUSE-SMD/CHIP
 Description Size:7.24x4.32mm. 4A 125V. PICO Fuse. Slo-Blo Fuse. (Time Delay Fuse). 피코휴즈. 피코퓨즈. 슬로블로휴즈.
 Vendor LF
 D/C 95+
 Part No. R460004. 0460004
 Q'ty 4900 EA
 Item FUSE-SMD/CHIP
 Description Size:6.1x2.69mm. 125V 3A. Slo-Blo Fuse
 Vendor LF
 D/C n/a
 Part No. R452003. 125V3A
 Q'ty 920 EA
 Item FUSE-SMD/CHIP
 Description Size:2.69x6.1mm. 125V 5A. NANO FUSE. SUBMINIATURE SURFACE MOUNT. Very Fast-Acting.
 Vendor LF
 D/C n/a
 Part No. R451005. 125V 5A
 Q'ty 750 EA

   

 
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