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| Item |
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MLCC-2012-broken |
|
| Description |
|
Size:2012(0805). 103Z 50V. 10nF 50V--20%~+80%. 0.01uF 50V--20%~+80%. 10000pF 50V--20%~+80%. Ceramic Chip Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21F103ZBNCA. 10nf50V. 10000pF50V. 0.01uF50V. 103Z50V |
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| Q'ty |
|
2716 EA |
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| Item |
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MLCC-2012 |
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| Description |
|
Size:2012(0805). 103Z 50V. 10nF 50V--20%~+80%. 0.01uF 50V--20%~+80%. 10000pF 50V--20%~+80%. Ceramic Chip Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21F103ZBNC. 10nf50V. 10000pF50V. 0.01uF50V. |
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| Q'ty |
|
4000 EA |
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| Item |
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MLCC-2012-broken |
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| Description |
|
Size:2012(0805). 750J 100V. 75pF 100V. Chip Ceramic Capacitor. 칩세라믹콘덴서 |
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| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C750JCNCA. 750J100V. 75pF100V |
|
| Q'ty |
|
3600 EA |
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| Item |
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MLCC-2012 |
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| Description |
|
2012. 6R8D 50V. 6.8pF 50V-±0.5pF |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C6R8DBNC |
|
| Q'ty |
|
4000 EA |
|
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| Item |
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MLCC-2012-broken |
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| Description |
|
Size:2012(0805). 6R8D 50V. 6.8pF 50V-±0.5pF. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서 |
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| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C6R8CBNC. 6.8pF50V. 6R8C50V |
|
| Q'ty |
|
3800 EA |
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|
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| Item |
|
MLCC-2012 |
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| Description |
|
Size:2012(0805) 100J 50V, 10pF 50V-5%, MLCC, SMD/Chip Ceramic Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서 |
|
| Vendor |
|
SAMSNG |
|
| D/C |
|
04+ |
|
| Part No. |
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CL21C100JBNC, 100J50V, 10pF50V-J, CL21C100JB8NNNC |
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| Q'ty |
|
36000 EA |
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| Item |
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MLCC-2012 |
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| Description |
|
Size:2012(0805) 100J 50V, 10pF 50V-5%, MLCC, SMD/Chip Ceramic Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서 |
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| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C100JBNC, 100J50V, 10pF50V-J, CL21C100JB8NNNC |
|
| Q'ty |
|
128000 EA |
|
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| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805) 100D 50V, 10pF 50V-± 0.5pF, MLCC, Ceramic SMD/Chip Capacitor, 세라믹 칩 콘덴서, 세라믹 칩 커패시터 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C100DBNC, 10pF50V-D, 100D50V, CL21C100DB8NNNC |
|
| Q'ty |
|
1330 EA |
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| Item |
|
MLCC-2012 |
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| Description |
|
Size:2012(0805) 100D 50V, 10pF 50V-± 0.5pF, MLCC, Ceramic SMD/Chip Capacitor, 세라믹 칩 콘덴서, 세라믹 칩 커패시터 |
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| Vendor |
|
SAMSUNG |
|
| D/C |
|
n/a |
|
| Part No. |
|
CL21C100DBNC, 10pF50V-D, 100D50V, CL21C100DB8NNNC |
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| Q'ty |
|
4000 EA |
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| Item |
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MLCC-2012 |
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| Description |
|
Size:2012(0805). 070D50V. 7pF 50V-±0.5pF. Multilayer Ceramic Chip Capacitor |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
01+ |
|
| Part No. |
|
CL21C070DBNC. 7pF50V. 2012CH7pF |
|
| Q'ty |
|
36000 EA |
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| Item |
|
IFT COIL |
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| Description |
|
Size:5.5x5.5x6.0mm. 54.25MHz IFT COIL. EX009K0A-548F. Pink Color |
|
| Vendor |
|
TOKO |
|
| D/C |
|
n/a |
|
| Part No. |
|
54.25MHz IFT COIL. 009A-548F. EX009K0A-548F |
|
| Q'ty |
|
1378 EA |
|
|
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| Item |
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MLCC-2012 |
|
| Description |
|
Size:2012(0805). 040C 50V. 4PF 50V-±0.25p. CHIP CERAMIC CAPACITOR |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C040CBNC. 4pF50V. 040C50V |
|
| Q'ty |
|
28000 EA |
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| Item |
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MLCC-2012-broken |
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| Description |
|
Size:2012(0805). 030C 50V. 3PF 50V-±0.25pf. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
n/a |
|
| Part No. |
|
CL21C030CBNCA. 3pF50V. 030C50V |
|
| Q'ty |
|
19700 EA |
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| Item |
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MLCC-2012 |
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| Description |
|
Size:2012(0805). 030C 50V. 3PF 50V-±0.25pf. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
93+ |
|
| Part No. |
|
CL21C030CBNCA. 3pF50V. 030C50V |
|
| Q'ty |
|
90000 EA |
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|
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| Item |
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MLCC-2012-broken |
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| Description |
|
Size:2012(0805). 010C 50V. 1pF 50V. Ceramic Chip Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C010BBNC. 1pF50V. 010C50V |
|
| Q'ty |
|
3280 EA |
|
|
|
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| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012. 683Z50V. 68nF 50V-+80%-20%. 0.068UF 50V-+80%-20%. 68000PF 50V-+80%-20%. Multilayer Ceramic Chip Capacitor |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21F683ZBNC |
|
| Q'ty |
|
4000 EA |
|
|
|
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|
|
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| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805). 563K 50V. 56nF 50V-10%. 0.056UF 50V-10%. 56000PF 50V-10%. X7R. Multilayer Ceramic Chip Capacitors. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21B563KBNC. 56nF50V-K. 56000PF50V-K. 0.056UF50V-K. 563K50V |
|
| Q'ty |
|
4000 EA |
|
|
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| Item |
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MLCC-2012 |
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| Description |
|
Size:2012(0805). 563K 50V. 56nF 50V-10%. 0.056UF 50V-10%. 56000PF 50V-10%. X7R. Multilayer Ceramic Chip Capacitors. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21B563KBNE. 56nF50V-K. 56000PF50V-K. 0.056UF50V-K. 563K50V |
|
| Q'ty |
|
6000 EA |
|
|
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| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805). 474K 16V. 470nF 16V. 0.47UF 16V. 470000PF 16V. X7R. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21B474KONEM. 470nF16V. 0.47UF16V. 470000pF16V. 474K16V |
|
| Q'ty |
|
1600 EA |
|
|
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| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805) 473K 50V, X7R, 47nF 50V-10%, 47000pF 50V, 0.047uF 50V, MLCC, Chip Ceramic Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
N/0+ |
|
| Part No. |
|
CL21B473KBNC, 47nF50V, 47000pF50V, 0.047uF50V, 473K50V |
|
| Q'ty |
|
2190 EA |
|
|
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[52].jpg)
[71].jpg)
