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 |
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| Item |
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MLCC-2012-broken |
|
| Description |
|
Size:2012(0805). 151J 50V. 150pF 50V-5%. Ceramic Chip Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
01+ |
|
| Part No. |
|
CL21C151JBNCA. 150pF50V. 151J50V |
|
| Q'ty |
|
2160 EA |
|
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| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805). 151J 50V. 150pF 50V-5%. Ceramic Chip Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
n/a |
|
| Part No. |
|
CL21C151JBNCA. 150pF50V. 151J50V |
|
| Q'ty |
|
3500 EA |
|
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| Item |
|
MLCC-2012 |
|
| Description |
|
2012. 122J 50V. 1.2nF 50V-5%. 1200PF 50V-5%. 0.12UF 50V-5%. CHIP CERAMIC CAPACITOR |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C122JBNE |
|
| Q'ty |
|
2000 EA |
|
|
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| Item |
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MLCC-2012 |
|
| Description |
|
Size:2012(0805). 121J 50V. 120pF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C121JBNC. 120pF50V-J. 121J50V |
|
| Q'ty |
|
4000 EA |
|
|
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| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805). 121J 50V. 120pF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C121JBNC. 120pF50V-J. 121J50V |
|
| Q'ty |
|
4000 EA |
|
|
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| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805). 121J 50V. 120pF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C121JBNC. 120pF50V-J. 121J50V |
|
| Q'ty |
|
24000 EA |
|
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| Item |
|
MLCC-2012 |
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| Description |
|
Size:2012(0805) C0G, NP0, 120J 50V, 12pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 세라믹 칩 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
n/a |
|
| Part No. |
|
CL21C120JBNCA, 12pF50V, 120J50V |
|
| Q'ty |
|
4000 EA |
|
|
|
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| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805) C0G, NP0, 120J 50V, 12pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 세라믹 칩 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C120JBNC, 12pF50V, 120J50V |
|
| Q'ty |
|
3000 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805) 100J 50V, 10pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 칩 세라믹 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C100JB8NNNC, CL21C100JBNC, 100J50V, 10pF50V-J |
|
| Q'ty |
|
164000 EA |
|
|
|
|
|
|
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|
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|
| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805). 101J 100V. 100pF 100V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21C101JCNCA. 100pF100V. 101J100V |
|
| Q'ty |
|
3550 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805).101J 50V. 100pF 50V-5%. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C101JBNCA. 100pF50V. 101J50V |
|
| Q'ty |
|
1300 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805) 100J 50V, 10pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 칩 세라믹 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C100JBNC, 100J50V, 10pF50V-J, CL21C100JB8NNNC |
|
| Q'ty |
|
3600 EA |
|
|
|
|
|
|
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|
|
|
| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805). 2.2nF 50V. 2200pF 50V. 0.0022uF 50V. 222J 50V. Chip Monolithic Ceramic Capacitor. MONO. 모노콘덴서. 모노리틱콘덴서 |
|
| Vendor |
|
MURATA |
|
| D/C |
|
02+ |
|
| Part No. |
|
GRM40CH222J50 S500. 2.2nF50V. 2200pF50V. 222J50V |
|
| Q'ty |
|
3000 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805) C0G, NP0, 8R2C 50V, 8.2pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 세라믹 칩 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C8R2CBNC, 8.2pF50V, 8R2C50V |
|
| Q'ty |
|
2840 EA |
|
|
|
|
|
|
|
|
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|
| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805) C0G, NP0 180J 50V, 18pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 칩 세라믹 콘덴서, 칩 세라믹 커패시터 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C180JBNC, 18pF50V-J |
|
| Q'ty |
|
3800 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805) X7R, 181K 50V, 180pF 50V-10%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 세라믹 칩 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
02+ |
|
| Part No. |
|
CL21B181KBNC, 180pF50V, 181K50V |
|
| Q'ty |
|
0 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805) C0G/NP0, 560J 50V, 56pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 세라믹 칩 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C560JBNC, 56pF50V, 560J50V |
|
| Q'ty |
|
1500 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012-broken |
|
| Description |
|
Size:2012(0805) X7R, 821K 50V, 820pF 50V, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 칩 세라믹 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21B821KBNC, 82pF50V-K, 821K50V |
|
| Q'ty |
|
2850 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012 (0805). 220pF 50V. 221J 50V. MLCC. Chip Ceramic Capacitor |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C221JBNC. 220pF50V. 221J50V |
|
| Q'ty |
|
1046 EA |
|
|
|
|
|
|
|
|
|
|
| Item |
|
MLCC-2012 |
|
| Description |
|
Size:2012(0805) C0G, NP0, 8R2D 50V, 8.2pF 50V, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 세라믹 칩 커패시터, 세라믹 칩 콘덴서 |
|
| Vendor |
|
SAMSUNG |
|
| D/C |
|
00+ |
|
| Part No. |
|
CL21C8R2DBNC, 8.2pF50V, 8R2D50V |
|
| Q'ty |
|
4000 EA |
|
|
|
|
|
|
|
|
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