[Total : 9862] Click the product image. You can find more detail info. Part No.

 Item MLCC-2012
 Description Size:2012(0805) C0G, NP0, 221K 100V, 220pF 100V-10%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 적층 세라믹 칩 커패시터, 다층 세라믹 칩 콘덴서
 Vendor AVX
 D/C n/a
 Part No. 08051A221KAT050M, 220pF100V, 221K100V
 Q'ty 4700 EA
 Item FERRITE CORE
 Description Size:40x12x6.5mm (35x1mm). FLAT CABLE FERRITE CORE. 플랫 케이블 페라이트 코어
 Vendor TDK
 D/C 04+
 Part No. 40126.5mm
 Q'ty 0 EA
 Item MLCC-2012
 Description Size:2012(0805) Y5V, 105Z 16V, 1uF 16V, 1.0uF 16V-±80~20%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, MLCC, 다층 세라믹 칩 커패시터, 적층 세라믹 칩 콘덴서
 Vendor SAMHWA
 D/C 00+
 Part No. CS2012Y5V105Z160NRE, 1uF16V-Z, 1.0uF16V, 105Z16V
 Q'ty 1400 EA
 Item MLCC-2012
 Description Size:2012(0805) Y5V, 105Z 16V, 1uF 16V, 1.0uF 16V-±80~20%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, MLCC, 다층 세라믹 칩 커패시터, 적층 세라믹 칩 콘덴서
 Vendor SAMHWA
 D/C n/a
 Part No. CS2012Y5V105Z160NRE, 1uF16V-Z, 1.0uF16V, 105Z16V
 Q'ty 240000 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 105Z 16V. 1UF 16V-+80%-20%. 1.0UF 16V-+80%-20%. MCLL. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor KYOCERA
 D/C n/a
 Part No. CM21Y5V105Z16AT. 1uF16V. 1.0uF16V. 1000nF16V. 105Z16V
 Q'ty 3400 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 105Z 16V. 1UF 16V-+80%-20%. 1.0UF 16V-+80%-20%. MCLL. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor AVX
 D/C 00+
 Part No. 1uF16V-Z. 2012 MLCC. 1.0uF16V. 1000nF16V. 105Z16V
 Q'ty 3400 EA
 Item MLCC-2012-broken
 Description Size:2012(0805). 104K 25V. 100nF 25V. 0.1uF 25V. 100000pF 25V. Chip Monolithic Ceramic Capacitor. 칩모노리틱 세라믹콘덴서
 Vendor MURATA
 D/C 00+
 Part No. GRM40B104K25PT. 100nF25V. 0.1uF25V. 100000pF25V-K
 Q'ty 2900 EA
 Item MLCC-2012
 Description Size:2012(0805). 105Z 16V. 1UF 16V-+80%~-20%. 1.0UF 16V-+80%~-20%. Multi–layer ceramic chip capacitor. 칩세라믹콘덴서
 Vendor TAIYO YUDEN
 D/C 00+
 Part No. EMK212F105ZG-T. 1uF16V. 1.0uF16V. 105Z16V.
 Q'ty 24000 EA
 Item TRANSISTOR
 Description TO-92. 50V 150mA 625mW.
 Vendor KEC
 D/C 01+
 Part No. KTA1266Y. KTA1266-Y
 Q'ty 185 EA
 Item MLCC-2012
 Description Size:2012(0805) 105Z 16V, 1uF 16V-+80%~-20%, 1.0UF 16V-+80%~-20%, MLCC, Multilayer Ceramic SMD/Chip Capacitors
 Vendor SAMSUNG
 D/C n/a
 Part No. CL21F105ZONE, 1uF10V, 1.0uF10V, 105Z10V
 Q'ty 3000 EA
 Item MLCC-2012
 Description Size:2012(0805). 154K 16V. 150nF 16V-10%. 0.15UF 16V-10%. 150000PF 16V-10%. Multilayer Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 01+
 Part No. CL21B154KONC. 150nF16V-K. 0.15uF16V. 150000pF16V. 154K16V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 154K 16V. 150nF 16V-10%. 0.15UF 16V-10%. 150000PF 16V-10%. Multilayer Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21B154KONC. 150nF16V-K. 0.15uF16V. 150000pF16V. 154K16V
 Q'ty 12000 EA
 Item MLCC-2012
 Description Size:2012. 104K 50V. 100nF 50V-10%. 0.1UF 50V-10%. 100000PF 50V-10%. X7R. CHIP CERAMIC CAPACITOR
 Vendor SAMSUNG
 D/C 02+
 Part No. CL21B104KBNE. 104K50V. 100nF50V. 0.1UF50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805) CH, 471J 50V, 470pF 50V, MLCC, Surface Mount Multilayer Ceramic SMD/Chip Capacitor, 적층 세라믹 칩 커패시터, 다층 세라믹 칩 콘덴서
 Vendor PANASONIC
 D/C n/a
 Part No. ECJ2VC1H471J, ECUV1H471JCG, 470pF50V, 471J50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012 (0805). 683K 25V. 68nF 25V-10%. 0.068UF 25V-10%. 68000PF 25V-10%. X7R. MLCC. Multilayer Ceramic Chip Capacitors. 칩세라믹 콘덴서
 Vendor TDK
 D/C n/a
 Part No. C2012X7R1E683KT000N. 68nF25V-K. 68000pF25V. 0.068uF25V. 683K25V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012 (0805). 683K 25V. 68nF 25V-10%. 0.068UF 25V-10%. 68000PF 25V-10%. X7R. MLCC. Multilayer Ceramic Chip Capacitors. 칩세라믹 콘덴서
 Vendor TDK
 D/C n/a+
 Part No. C2012X7R1E683KT000N. 68nF25V-K. 68000pF25V. 0.068uF25V. 683K25V
 Q'ty 4000 EA
 Item MLCC-2012
 Description Size:2012(0805). 333K 50V. 33nF 50V-10%. 33000PF 50V-10%. 0.033UF 50V-10%. X7R. MLCC. SMD/Chip Ceramic Capacitor 칩세라믹콘덴서
 Vendor TDK
 D/C n/a
 Part No. C2012X7R1H333KT000N. 333K50V. 33nF50V-K. 33000pF50V. 0.033uF50V
 Q'ty 6000 EA
 Item MLCC-2012
 Description Size:2012(0805). 333K 50V. 33nF 50V-10%. 33000PF 50V-10%. 0.033UF 50V-10%. X7R. MLCC. SMD/Chip Ceramic Capacitor 칩세라믹콘덴서
 Vendor TDK
 D/C n/a
 Part No. C2012X7R1H333KT000N. 333K50V. 33nF50V-K. 33000pF50V. 0.033uF50V
 Q'ty 2000 EA
 Item MLCC-2012-broken
 Description Size:2012(0805) X7R, 333K 50V, 33nF 50V-10%, 0.033uF 50V-10%, 33000pF 50V, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL21B333KBNC, 33nF50V-K, 33000pF50V, 0.033uF50V, 333K50V
 Q'ty 1875 EA
 Item MLCC-2012
 Description Size:2012(0805) 223M 50V, 22nF 50V, 22000pF 50V-20%, X7R, MLCC, SMD/Chip Ceramic Capacitor, Multilayer Ceramic Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL21B223MBND, 22nF50V-M. 22000pF50V, 223M50V
 Q'ty 150000 EA

   

 

  CopyRight(c) 2000 Donghwan Electronics co.
LB-2041. B2F, Living, Garden5 Life, 634 Moonjung-Dong, Songpa-Gu, Seoul, Korea. Postal Code:05838
TEL : +82-2-2157-6070
Fax : +82-2-2157-6071      Email : ictr@ictr.co.kr