[Total : 9862] Click the product image. You can find more detail info. Part No.

 Item MLCC-1608
 Description Size:1608(0603) C0G, 681J 50V, 680pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 다층 세라믹 SMD/칩 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL10C681JBNC, 680pF50V-J, 681J50V
 Q'ty 4000 EA
 Item MLCC-2012
 Description 2012. 680J 50V. 68pF 50V-5%
 Vendor TDK
 D/C 99+
 Part No. C2012COG1H680JT000A
 Q'ty 4000 EA
 Item MLCC-1608
 Description 1608. 561J 50V. 560PF 50V-5%. Multilayer Ceramic Capacitor
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C561JBNC
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608(0603) 471K 50V, 470pF 50V-10%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C471KBNC, 470pF50V, 471K50V
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608(0603) 3.3pF 50V-±0.25pF, 3R3C 50V, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C3R3CBNC A, 3.3pF50V, 3R3C50V
 Q'ty 3650 EA
 Item MLCC-1608
 Description Sise:1608(0603). 330J 50V. 33PF 50V-5%. MLCC. SMD/CHIP CERAMIC CAPCITOR. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 03+
 Part No. CL10C330JBNC. 33pF50V-J. 330J50V
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608. 220J 50V. 22PF 50V-5%. Multilayer Ceramic Chip Capacitors
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C220JBNC
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608. 200J 50V. 20pF 50V-5%
 Vendor SAMSUNG
 D/C 00+
 Part No. CL10C200JBNC
 Q'ty 12000 EA
 Item MLCC-1608
 Description 1608. 1R8C 50V. 1.8PF 50V-±0.25pf. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C1R8CBNC
 Q'ty 20000 EA
 Item MLCC-1608-broken
 Description Size:1608(0603). 150J 50V. 15pF 50V 5%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 01+
 Part No. CL10C150JBNC. 15pF50V. 150J50V
 Q'ty 3900 EA
 Item MLCC-1608
 Description Size:1608(0603). 101J 50V. 100PF 50V-5%. MLCC. SMD/Chip Ceramic Cihp Capacitor. 칩세라믹콘덴서.
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C101JBNC. 100pF50V-J. 101J50V
 Q'ty 0 EA
 Item MLCC-1608
 Description Size:1608(0603) C0G(NP0) 101J 50V, 100PF 50V-5%, MLCC, Multilayer Ceramic SMD/Cihp Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서.
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C101JBNC, 100pF50V-J, 101J50V
 Q'ty 1100 EA
 Item MLCC-1608
 Description Size:1608(0603) X7R, 562K50V, 5.6nF50V-10%, 5600pF50V, 0.0056uF50V, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 다층 세라믹 SMD/칩 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 02++
 Part No. CL10B562KBNC, 5.6nF50V-K, 5600pF50V, 0.0056uF50V, 562K50V
 Q'ty 2400 EA
 Item MLCC-1608
 Description Size:1608(0603) X7R, 563K 16V, 56nF 16V-10%, 0.056uF 16V-10%.,56000pF 16V-10%, MLCC, Multilayer Ceramic SMD/Chip Capacitors, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10B563KONC, 56nF16V, 56000pF16V, 0.056uF16V, 563K16V
 Q'ty 2522 EA
 Item MLCC-1608
 Description Size:1608(0603). 100J 50V. 10PF 50V-5%. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C100JBNC. 10pF50V-J. 100J50V
 Q'ty 8000 EA
 Item MLCC-1608-broken
 Description Size:1608(0603) 121J 50V, 120pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 칩 세라믹 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL10C121JBNC, 120pF50V-J, 121J50V
 Q'ty 2386 EA
 Item MLCC-1608
 Description Size:1608(0603) C0G, 391J 50V, 390pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 다층 세라믹 SMD/칩 커패시터, 칩 세라믹 콘덴서
 Vendor SAMSUNG
 D/C 04+
 Part No. CL10C391JBNC, 390pF50V-J, 391J50V
 Q'ty 4000 EA
 Item MLCC-1608
 Description Size:1608(0603). 100D 50V. 10PF 50V-±0.5PF. MLCC. SMD/Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 04+
 Part No. CL10C100DBNC. 10pF50V-D. 100D50V
 Q'ty 8000 EA
 Item MLCC-0603
 Description Size:0603(0201). 1.3pF25V-0.1%. SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
 Vendor MURATA
 D/C n/a
 Part No. GRM33CH1R3B25 M641. 1.3pF25V-B
 Q'ty 15000 EA
 Item MLCC-1608
 Description Size:1608(0603). 070C 50V. 7PF 50V-±.25pf. Multilayer Ceramic Chip Capacitor
 Vendor SAMSUNG
 D/C 02+
 Part No. CL10C070DBNC. 7pF50V. 1608CH7pF
 Q'ty 4000 EA

   

 

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