[Total : 9756] Click the product image. You can find more detail info. Part No.

 Item MLCC-1005-broken
 Description Size:1005(0402). 390 J50V. 39pF 50V. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor KYOCERA
 D/C 00+
 Part No. CM05CH390J50AT. 39pF50V. 390J50V
 Q'ty 6300 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 270J 50V. 27pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor KYOCERA
 D/C 00+
 Part No. CM05CH270J50AT. 27pF50V. 270J50V
 Q'ty 7900 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 220J 50V. 22pF 50V 5%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor KYOCERA
 D/C 00+
 Part No. CM05CH220J50AT. 22pF50V. 220J50V
 Q'ty 5400 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 120J 50V. 12PF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor KYOCERA
 D/C 00+
 Part No. CM05CG120J50AT. 12pF50V. 120J50V
 Q'ty 6200 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 390J 50V. 39pF 50V 5%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL05C390JBNC. 39pF50V. 390J50V
 Q'ty 9000 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 12pF 50V. 120J 50V. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL05C120JBNC. 12pF50V. 120J50V
 Q'ty 8900 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 100pF50V. 101J 50V. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL05C101JBNC. 100pF50V. 101J50V
 Q'ty 9000 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 0R5C 50V. 0.5pF 50V 0.25%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL05C0R5CBNC. 0.5pF50V. 0R5C50V
 Q'ty 5000 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 0R5C 50V. 0.5pF 50V 0.25%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C n/a
 Part No. CL05C0R5CBNC. 0.5pF50V. 0R5C50V
 Q'ty 9600 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 030C 50V. 3pF 50V 0.5%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL05C030CBNC. 3pF50V. 030C50V
 Q'ty 9400 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 561K 50V. 560pF 50V. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL05B561KBNC. 560pF50V. 561K50V
 Q'ty 9700 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 471K 50V. 470pF 50V. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor SAMSUNG
 D/C 00+
 Part No. CL05B471KBNC. 470pF50V. 471K50V
 Q'ty 9000 EA
 Item FUSE-GLASS BODY-5x20mm
 Description Size:5x20mm. 250V4A. Time Lag Fuse. Glass Fuse. 타임래그퓨즈/휴즈
 Vendor LF
 D/C 15+
 Part No. 0218004.MXP
 Q'ty 550 EA
 Item FUSE-MICRO/PICO
 Description Size:8.5x7.6mm. T6.3A 250V. Time Lag Micro Fuse. Circle Radial Type. 타임래그 마이크로휴즈. RoHS
 Vendor BUSSMANN
 D/C 15+
 Part No. T6.3A250V. BUSS SR-5
 Q'ty 170 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 473Z 16V. 47nF 16V. 47000pF 16V. 0.047uF 16V. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor TDK
 D/C 00+
 Part No. C1005Y5V1C473ZT00A. 47nF16V. 47000pF16V. 0.047uF16V. 473Z16V
 Q'ty 4500 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 561k 50V. 560pF 50V 10%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor TDK
 D/C 00+
 Part No. C1005JB1H561KT000P. 560pF50V. 561K50V
 Q'ty 9000 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 561K 50V. 560pF 50V 10%. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor TDK
 D/C 00+
 Part No. C1005JB1H561KT000P. 560pF50V. 561K50V
 Q'ty 6350 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 562K 25V. 5.6nF 25V. 5600pF 25V. 0.0056uF 25V. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서
 Vendor TDK
 D/C 00+
 Part No. C1005JB1E562KT00A. 5.6nF25V. 5600pF25V. 0.0056uF25V. 562K25V.
 Q'ty 9800 EA
 Item MLCC-1005
 Description Size:1005 (0402). 680J 50V. 68pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩 세라믹 콘덴서. 칩 세라믹 커패시터
 Vendor TDK
 D/C 00+
 Part No. C1005C0G1H680JT000P. 68pF50V-J
 Q'ty 70000 EA
 Item MLCC-1005-broken
 Description Size:1005(0402). 270J 50V. 27pF 50V. Chip Ceramic Capacitor. 칩세라믹콘덴서
 Vendor TDK
 D/C 00+
 Part No. C1005CH1H270JT00A. 27pF50V. 270J50V
 Q'ty 9000 EA

   

 
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