[Total : 12650 ] If you click the Part No.,you can see the detail information Part No.   
Item Part No. Description DataSheet Q'ty Vendor D/C Remark
MLCC-2012 CL21C271JBNC. 270pF50V-J. 271J50V Size:2012(0805). 271J 50V. 270PF 50V-5%. COG. Multilayer Ceramic Chip Capacitor 20000 SAMSUNG 00+ reel 4000 pcs
MLCC-2012-broken CL21C271JBNC. 270pF50V-J. 271J50V Size:2012(0805). 271J 50V. 270PF 50V-5%. COG. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 1543 SAMSUNG n/a broken reel
MLCC-2012 CL21C300JBNC. 30pF50V-J. 300J50V Size:2012 (0805). 300J 50V. 30pF 50V-5%. MLCC. Multilayer Ceramic SMD/Chip Capacitor. 칩 세라믹 콘덴서. 칩 세라믹 커패시터 64000 SAMSUNG 05+ reel 4000 pcs
MLCC-2012 CL21C300JBNC. 30pF50V-J. 300J50V Size:2012 (0805). 300J 50V. 30pF 50V-5%. MLCC. Multilayer Ceramic SMD/Chip Capacitor. 칩 세라믹 콘덴서. 칩 세라믹 커패시터 64000 SAMSUNG 05++ reel 4000 pcs
MLCC-2012 CL21C300JBNC. 30pF50V-J. 300J50V Size:2012 (0805). 300J 50V. 30pF 50V-5%. MLCC. Multilayer Ceramic SMD/Chip Capacitor. 칩 세라믹 콘덴서. 칩 세라믹 커패시터 24000 SAMSUNG 06+ reel 4000 pcs
MLCC-2012 CL21C301JBNC. 300pF50V-J. 301J50V Size:2012 (0805). 300pF 50V-5%. 301J 50V. C0G. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 4000 SAMSUNG 05+ reel 4000 pcs
MLCC-2012 CL21C301JBNC. 300pF50V-J. 301J50V Size:2012 (0805). 300pF 50V-5%. 301J 50V. C0G. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 8000 SAMSUNG 05+ reel 4000 pcs
MLCC-2012 CL21C330JBANNNC 2012-330J50V. RoHS 0 SAMSUNG 09+ reel 4000pcs
MLCC-2012 CL21C330JBANNNC. 33pF50V-J. 330J50V Size:2012(0805). 33pF 50V-5%. 330J 50V. C0G. MLCC. Multilayer Ceramic Capacitors. SMD/Chip Ceramic Capacitor. 칩세라믹 콘덴서. 칩 세라믹 커패시터 4000 SAMSUNG n/a reel 4000pcs
MLCC-2012 CL21C330JBNC 2012-330J50V 0 SAMSUNG n/a reel 4000pcs
MLCC-2012 CL21C330KBNC. 33pF50V-K. 330K50V. 2012CH10pF Size:2012(0805). 330K 50V. 33pF50V-10%. C0G. COG. Chip ceramic Capacitor 0 SAMSUNG 00+ reel 4000 pcs
MLCC-2012 CL21C331JBANNNC. 330pF50V-J. 331J50V Size:2012(0805). 330J 50V. 330PF 50V-±5%. Ceramic Chip Capacitor. 칩세라믹콘덴서. ROHS 0 SAMSUNG 06+ 4000pcs
MLCC-2012-broken CL21C331JBNC. 330pF50V-J. 331J50V Size:2012(0805). 330J 50V. 330PF 50V-±5%. Ceramic Chip Capacitor. 칩세라믹콘덴서 3270 SAMSUNG 02+ broken reel
MLCC-2012 CL21C390JBNC 2012. 390J 50V. 39PF 50V-5%. Multilayer Ceramic Chip Capacitors 8000 SAMSUNG 02+ reel 4000 pcs
MLCC-2012 CL21C390JCNC 2012. 390J 100V. 39PF 100V-5%. Multilayer Ceramic Chip Capacitors 3000 SAMSUNG 00+ reel 3000pcs
MLCC-2012 CL21C391JBNC. 391J50V. 390pF50V-J. 2012CH390PF Size:2012(0805). 391J 50V. 390pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 11600 SAMSUNG n/a+ reel 4000pcs
MLCC-2012 CL21C391JBNCA. 390pF50V-J. 391J50V. 2012CH390PF Size:2012(0805). 391J 50V. 390pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 4000 SAMSUNG n/a++ reel 4000pcs
MLCC-2012-broken CL21C3R3CBNC. 3.3pF50V. 3R3C50V Size:2012(0805. 3.3pF 50V-±0.25pf. ). 3R3C 50V. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 3600 SAMSUNG 00+ broken reel
MLCC-2012 CL21C470JBNC. 47pF50V. 470J50V Size:2012(0805). 47pF 50V-5%. 470J 50V. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서 4000 SAMSUNG 00+ reel 4000pcs
MLCC-2012-broken CL21C470JCNCA. 47pF100V. 470J100V Size:2012(0805). 47pF 100V-5%. 470J 100V. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서 2976 SAMSUNG 00+ broken reel
   

 
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