[Total : 12650 ] If you click the Part No.,you can see the detail information Part No.   
Item Part No. Description DataSheet Q'ty Vendor D/C Remark
MLCC-3216 CL31C330JBNCA, CL31C330JBNC, 33pF50V-J, 330J50V Sise:3216(1206) C0G(CH) 330J 50V, 33pF 50V-5%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, MLCC, 다층 세라믹 SMD/칩 커패시터, 콘덴서 4000 SAMSUNG n/a reel 4000pcs
MLCC-3216-broken CL31C391JBNCA. 390pF50V. 391J50V Size:3216(1206). 391J 50V. 390pF 50J-5%. MLCC. Multilayer Ceramic Capacitors. Chip Ceramic Capacitor. 칩세라믹콘덴서 3980 SAMSUNG 00+ broken reel
MLCC-3216-broken CL31C470JBNC. 47pF50V. 470J50V Size:3216(1206). 470J 50V. 47pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 3500 SAMSUNG 02+ broken reel
MLCC-3216-broken CL31C470JBNC. 47pF50V. 470J50V Size:3216(1206). 470J 50V. 47pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 3500 SAMSUNG 02+ broken reel
MLCC-3216-broken CL31C470JBNC. 47pF50V. 470J50V Size:3216(1206). 470J 50V. 47pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 3500 SAMSUNG 02+ broken reel
MLCC-3216-broken CL31C470JBNC. 47pF50V. 470J50V Size:3216(1206). 470J 50V. 47pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 3400 SAMSUNG 02+ broken reel
MLCC-3216 CL31C470JBNC. 47pF50V. 470J50V Size:3216(1206). 470J 50V. 47pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 12000 SAMSUNG 02+ reel 4000pcs
MLCC-3216-broken CL31C470JBNCA. 47pF50V. 470J50V Size:3216(1206). 470J 50V. 47pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 3980 SAMSUNG 00+ broken reel
MLCC-3216 CL31C470JBNCA. 47pF50V. 470J50V Size:3216(1206). 470J 50V. 47pF 50V-5%. MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 8000 SAMSUNG 96+ reel 4000pcs
MLCC-3216 CL31C561JBNCA 3216-561J50V 0 SAMSUNG n/a
MLCC-3216 CL31C680JBNCA, CL31C680JBNC, 68pF50V, 680J50V Size:3216(1206) C0G, 681J 50V, 68pF 50V, MLCC, Multilayer Ceramic SMD/Chip Capacitor, MLCC, 세라믹 칩 커패시터, 세라믹 칩 콘덴서 28000 SAMSUNG n/a reel 4k or 5kpcs
MLCC-3216-broken CL31C681JBNC. 680pF50V Size:3216(1206). 681J 50V. 680pF50V. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서 3860 SAMSUNG 00+ broken reel
MLCC-3216 CL31C681JBNCM. 680pF50V. 681J50V Size:3216(1206). 681J 50V. 680pF50V. MLCC. Chip Ceramic Capacitor. 칩세라믹콘덴서 4000 SAMSUNG n/a Paper reel 4000pcs
MLCC-3216-broken CL31C821JBNC. 820pF50V. 820J50V Size:3216(1206). 821J 50V. 820pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 2000 SAMSUNG 00+ Broken reel
MLCC-3216 CL31C821JBNC. 820pF50V. 820J50V Size:3216(1206). 821J 50V. 820pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 32000 SAMSUNG 00+ reel 4000 pcs
MLCC-3216 CL31C821JBNCA. 820pF50V. 820J50V Size:3216(1206). 821J 50V. 820pF 50V-5%. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 4000 SAMSUNG 96+ reel 4000 pcs
MLCC-3216 CL31F104ZBNC. 104Z50V. 100nF50V. 0.1uF50V Size:3216. 104Z 50V. 100nF 50V-+80%~-20%. 0.1UF 50V-+80%-20%. 100000PF 50V-+80%~-20%. CHIP CERAMIC CAPACITOR 12000 SAMSUNG 00+ reel 4000 pcs
MLCC-3216 CL31F224MBNC 3216-224M50V 0 SAMSUNG n/a
MLCC-3216 CL31F224MBNC 3216. 224M 50V. 220nF 50V-20%. 0.22UF 50V-20%. 220000PF 50V-20%. CHIP CERAMIC CAPACITOR 4000 SAMSUNG 00+ reel 4000pcs
MLCC-3216 CL31F225ZONC, 2.2uF16V-Z, 225Z16V Size:3216(1206) Y5V, 225Z 16V, 2.2uF 16V-±80~20%, MLCC, Multilayer Ceramic SMD/Chip Capacitor, 다층 세라믹 칩 커패시터, 적층 세라믹 칩 콘덴서 23400 SAMSUNG 02+ reel 4000 pcs
   

 
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